Apple signs deal with new chipmaker TSMC for future phone

Wednesday, June 26, 2013

Apple has recently signed a new deal with Taiwan Semi-conductor Manufacturing Company  (TSMC) as the makers for the chips of the next-gen Apple phones. The company will be providing 20nm, 16nm and 10nm chips to Apple that would be used in devices starting from early next year.

In a three-year agreement between the two, Taiwanese chip maker will start manufacturing Apple's A8 chips in July 2013, but in small volume with high volume actual production expected to come after December.

Apple earlier made its chips from Samsung but with ongoing court cases between the two, the company has entered into a deal with the new party for future phones.

You can follow us on Twitter or Join us on Facebook to receive all updates . . .

Share your views...

0 Respones to "Apple signs deal with new chipmaker TSMC for future phone"

Post a Comment


Connect with us


© 2010 - 2021 All Rights Reserved | Contact Us | About Us | Privacy Policy | Terms of Use |